HDI PCB 10 Layer 1.6 MM Thickness FR4 TG 170 Material
PCB Specifications:
1 Part NO: HDIPCB0014
2 Layer Count: 10 Layer HDI PCB
3 Finished Board Thickness: 1.6MM
4 3+N+3 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L3 0.1MM, L3-L8 0.1MM, L8-L9 0.1MM, L9-L10 0.1MM, L8-L10 0.1MM, L1-L100.2MM
5 Min Lind Space&Width: 2.0/2.4mil
6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1
7 Application Area: Industrial Control
8 PCB Size: 100mm*95mm/1pcs
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.
S1000-2 Data Sheet:
| S1000-2 |
| Items |
Method |
Condition |
Unit |
Typical Value |
| Tg |
IPC-TM-650 2.4.25 |
DSC |
℃ |
180 |
| IPC-TM-650 2.4.24.4 |
DMA |
℃ |
185 |
| Td |
IPC-TM-650 2.4.24.6 |
5% wt. loss |
℃ |
345 |
| CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
45 |
| After Tg |
ppm/℃ |
220 |
| 50-260℃ |
% |
2.8 |
| T260 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
60 |
| T288 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
20 |
| T300 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
5 |
| Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
100S No Delamination |
| Volume Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ.cm |
2.2 x 108 |
| E-24/125 |
MΩ.cm |
4.5 x 106 |
| Surface Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ |
7.9 x 107 |
| E-24/125 |
MΩ |
1.7 x 106 |
| Arc Resistance |
IPC-TM-650 2.5.1 |
D-48/50+D-4/23 |
s |
100 |
| Dielectric Breakdown |
IPC-TM-650 2.5.6 |
D-48/50+D-4/23 |
kV |
63 |
| Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
4.8 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
0.013 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Peel Strength (1Oz HTE copper foil) |
IPC-TM-650 2.4.8 |
A |
N/mm |
— |
| After thermal Stress 288℃,10s |
N/mm |
1.38 |
| 125℃ |
N/mm |
1.07 |
| Flexural Strength |
LW |
IPC-TM-650 2.4.4 |
A |
MPa |
562 |
| CW |
IPC-TM-650 2.4.4 |
A |
MPa |
518 |
| Water Absorption |
IPC-TM-650 2.6.2.1 |
E-1/105+D-24/23 |
% |
0.1 |
| CTI |
IEC60112 |
A |
Rating |
PLC 3 |
| Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| E-24/125 |
Rating |
V-0 |
Product Tags:
|
|
10 Layer 1.6 MM HDI PCB Thickness FR4 TG 170 Material Images
|
