HDI PCB 4 Layer Blue Solder Mask Immersion Gold Treatment 1.6 MM Thickness
PCB Specifications:
1 Part NO: HDIPCB0006
2 Layer Count: 4 Layer HDI PCB
3 Finished Board Thickness: 1.6MM
4 Hole Structure: L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM
5 Min Lind Space&Width: 4/4mil
6 Copper Thickness: 1/H/H/1
7 Application Area: WIFI Module
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
S1150G Data Sheet:
| S1150G |
| Items |
Method |
Condition |
Unit |
Typical Value |
| Tg |
IPC-TM-650 2.4.25 |
DSC |
℃ |
155 |
| Td |
IPC-TM-650 2.4.24.6 |
5% wt. loss |
℃ |
380 |
| CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
36 |
| After Tg |
ppm/℃ |
220 |
| 50-260℃ |
% |
2.8 |
| T260 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
>60 |
| T288 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
30 |
| Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
pass |
| Volume Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ.cm |
6.4 x 107 |
| E-24/125 |
MΩ.cm |
5.3 x 106 |
| Surface Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ |
4.8 x 107 |
| E-24/125 |
MΩ |
2.8 x 106 |
| Arc Resistance |
IPC-TM-650 2.5.1 |
D-48/50+D-4/23 |
s |
140 |
| Dielectric Breakdown |
IPC-TM-650 2.5.6 |
D-48/50+D-4/23 |
kV |
45+kV NB |
| Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
4.8 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
0.01 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Peel Strength (1Oz HTE copper foil) |
IPC-TM-650 2.4.8 |
A |
N/mm |
— |
| After thermal Stress 288℃,10s |
N/mm |
1.4 |
| 125℃ |
N/mm |
1.3 |
| Flexural Strength |
LW |
IPC-TM-650 2.4.4 |
A |
MPa |
600 |
| CW |
IPC-TM-650 2.4.4 |
A |
MPa |
450 |
| Water Absorption |
IPC-TM-650 2.6.2.1 |
E-1/105+D-24/23 |
% |
0.1 |
| CTI |
IEC60112 |
A |
Rating |
PLC 0 |
| Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| E-24/125 |
Rating |
V-0 |
Product Tags:
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HDI Electric Circuit Board PCB 4 Layer Blue Solder Mask Immersion Gold Enig Images
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