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Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate

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Witgain Technology Limited

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Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate

Name: Matte Green Solder HDI PCB 10 Layer 16 MM Thickness FR4 Substrate
Brand: WITGAIN PCB
Price: 1 USD

Best Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate wholesale

Brand Name : WITGAIN PCB

Model Number : HDIPCB0015

Certification : UL

Place of Origin : China

MOQ : 1pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100kpcs/Month

Delivery Time : 25 days

Packaging Details : vacuum package in bubble wrap

Layer Count : 10 Layer

Board Thickness : 1.6MM

PCB Kind : HDI PCB

Min Hole : 0.1MM

Impedance Control : 50 Ohm

Surface Treatment : Immersion Gold 3U'

Size : 154mm*143mm/1pcs

BGA Size : 16 MIL

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HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Green Solder Mask

PCB Specifications:

1 Part NO: HDIPCB0014

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 2+N+2 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L2-L9 0.2MM,L8-L9 0.1MM, L9-L10 0.1MM, L1-L100.2MM

5 Min Lind Space&Width:5/5mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Automobile

8 PCB Size: 154mm*143mm/1pcs

9 PCB Drawing File Size: Gerber File

X-OUT per panel:

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

S1000-2 Data Sheet:

S1000-2
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	180
Tg		IPC-TM-650 2.4.24.4	DMA	℃	185
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	345
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	45
			After Tg	ppm/℃	220
			50-260℃	%	2.8
T260		IPC-TM-650 2.4.24.1	TMA	min	60
T288		IPC-TM-650 2.4.24.1	TMA	min	20
T300		IPC-TM-650 2.4.24.1	TMA	min	5
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	100S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	2.2 x 108
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.5 x 106
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	7.9 x 107
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	1.7 x 106
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	100
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	63
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.8
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.013
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength (1Oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.38
			125℃	N/mm	1.07
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	562
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	518
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.1
CTI		IEC60112	A	Rating	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Product Tags:

1.6 MM HDI PCB

FR4 Substrate HDI PCB

10 Layer Matte Green PCB

Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Images

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